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師資陣容-林建宏

教師簡介 Profile

姓名 Name

林建宏 Chien-Hung Lin

職稱 Title

專任副教授兼所長   Associate Professor  And Director

教研室 Office

大義館 624-10室

電話 Phone

02-28610511 ext 33701

傳真 Fax

02-28615241

電子郵件 E-mail

ljh13@faculty.pccu.edu.tw

個人網頁 Homepage

實驗室 Lab.

實習工廠實驗室

主要學歷

Educations

國立清華大學微機電系統工程研究所博士

學界經歷

Experiences of academy

中國文化大學機械工程學系助理教授(97,08~102,02)

業界經歷

Experiences of industry

百容電子股份有限公司產品工程師(86,6~88,3)

工業技術研究院機械所特約人員(92,9~95,12)

清華大學動力機械工程學系博士後研究員(96,7~97,6)

研究領域

Research interests

奈米轉印微影技術(Nanoimprint lithography)

先進奈微米製造技術(Nano/microfabrication)

影像處理自動化量測距下關節之最佳中立位置(Iimage process to automation measurement for optimizing neutral position of subtalar joint)

影像回饋控制於微小物件夾取之運動平台(Image feedback on a movement platform for clipping miniature objects)

教學課程

Teaching courses

工廠實習

電路學、應用電子學、基礎光學

機械設計原理、光電概論、感測原理與應用

半導體製程技術導論、微機電系統

研究計畫 (Research projects)

國科會/科技部 專題研究計畫案

8

MOST 103-2221-E-034-008

計畫主持人:林建宏

利用影像處理自動化量測距下關節之最佳中立位置(103,8,1~104,7,31)

7

NSC 101-2221-E-007-071-MY3

共同主持人:林建宏

生物球實驗平台自動化與即時環境監控(101,8,1~104,7,31)

6

NSC 100-2221-E-034-010

計畫主持人:林建宏

發展週期性奈米轉印模仁技術於表面電漿子結構特性之研究(100,8,1~101,7,31)

5

NSC 98-2221-E-007-004-MY3

共同主持人:林建宏

昆蟲刺激與行為監測平台之控制與系統自動化(98,8,1~101,7,31)

4

NSC 98-2221-E-034-005-MY2

計畫主持人:林建宏

發展超音波及紫外光硬化型奈米轉印技術於可撓式基板之應用(98,8,1~100,7,31)

3

NSC 97-2218-E-034-004

計畫主持人:林建宏

發展超音波及紫外光硬化型奈米轉印技術於可撓式基板之應用(97,9,1~98,7,31)

2

1

國科會/科技部 大專生專題計畫案

4

103年度大專生參與國科會專題研究計畫,NSC 103-2815-C-034-060-E,超音波崁入式奈米轉印之研究,專題學生:方少坤,指導教授:林建宏,執行起迄:103,7,1~104,2,28

3

100年度大專生參與國科會專題研究計畫,NSC 100-2815-C-034-002-E,表面電漿微影術之先導性研究,指導學生:劉姝瑜,指導教授:林建宏,執行起迄:100,7,1~101,2,28

2

1

產學合作計畫案

3

2

1

研究著作 (Publications)

一、期刊論文

(1) Y. C. Kang, C. H. Lin, and R. Chen*, “Capacitively catenary feedback control for open-type digital microfluidics,” Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 13, No. 1, pp. 013013-1-6, 2014. (SCI)
(2) P. Y. Tseng and C. H. Lin*, “Impacts of mold material and pattern size for ultrasonic nanoimprint lithography,” Microelectronic Engineering, Vol. 98, pp. 112-116, 2012. (SCI)
(3) C. H. Lin* and R. Chen, “New approaches of mold fabrication for nanoimprint lithography,” Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 10, No. 1, pp. 011506-1-6, 2011. (SCI)
(4) C. Y. Wang,P.Y. Tseng, and C. H. Lin*, “Replication of polyethylene terephthalate (PET) nano/micro structures using ultrasonic nanoimprint,” Proceedings of 2011 IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), pp. 563-566, 2011. (EI)
(5) C. H. Lin*, C. Y. Wang, and R. Chen, “Heating-Assisted for Ultrasonic Nanoimprint Lithography,” Journal of Chinese Society of Mechanical Engineers, Vol. 31, No. 3, pp. 229-233, 2010. (SCI)
(6) C. H. Lin*, C. Y. Wang, and R. Chen, “Assisted-Heating for Ultrasonic Nanoimprint Lithography,” Proceedings of IEEE Conference on Nanotechnology, pp. 126-129, 2009. (EI)
(7) H. Hocheng*, C. M. Chen, Y. C. Chou, and C. H. Lin, “Study of Novel Electrical Routing and Integrated Packaging on Bio-compatible flexible Substrates,” Microsystem Technologies, Vol. 16, No. 3, pp. 423-430, 2009. (SCI)
(8) C. H. Lin and R. Chen*, “Impact of Mold Geometries and Imprinted Resist Thickness on Velocity Fields for Nanoimprint Lithography,” Japanese Journal of Applied Physics, Vol. 47, No. 6, pp. 5197-5203, 2008. (SCI)
(9) C. H. Lin and R. Chen*, “Effects of mold geometries and imprinted polymer resist thickness on ultrasonic nanoimprint lithography,” Journal of Micromechanics and Microengineering, Vol. 17, No 7, pp. 1220-1231, 2007. (SCI)
(10) Y. L. Lai* and C. H. Lin, “Investigation of structures of microwave microelectromechanical system switches by taguchi method,” Japanese Journal of Applied Physics, Vol. 46, No 10, pp. 6539-6545, 2007. (SCI)

二、國際研討會

(1) S. Y. Liu, P. Y. Tseng, and C. H. Lin, “Finite Element Analysis of Antireflective SubwaveLength Periodic Structures,” 6th Asia-Pacific Conference on Transducers and Micro-Nano Technology, Nanjing, China, July 8-11, 2012.
(2) C. H. Lin and P. Y. Tseng, “The Design and Analysis in Passive Compliant Stage for Nanoimprint Lithography,” 6th Asia-Pacific Conference on Transducers and Micro-Nano Technology, Nanjing, China, July 8-11, 2012.
(3) P. Y. Tseng, R. Chen, C. H. Lin, and S. H. Liao, “Impact of Mold Material for Ultrasonic Nanoimprint Lithography,” 37th International Conference on Micro and Nano Engineering, Berlin, Germany, Sep.19-23, 2011.
(4) P. Y. Tseng, R. Chen, and C. H. Lin, “The Effects of Replicated Micro/Submicro Patterns Using Ultrasonic Nanoimprint,” International Conference on Materials for Advanced Technologies, Suntec, Singapore, Jun. 26- Jul. 1, 2011.
(5) H. C. Su, R. Chen, and C. H. Lin, “Fabrication of Highly Ordered ZnO Nanowire Arrays Using Microcontact Printing,” International Conference on Materials for Advanced Technologies, Suntec, Singapore, Jun 26- Jul 1, 2011.
(6) C. Y. Wang, P. Y. Tseng, and C. H. Lin, “Replication of Polyethylene Terephthalate (PET) Nano/Micro Structures Using Ultrasonic Nanoimprint,” 6th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Kaohsiung, Taiwan, Feb. 20-23, 2011.
(7) C. H. Lin, C. Y. Wang, and H. C. Su, “The New Concepts of Mold Fabrication Technology for Nanoimprint lithography,” 5th Asia-Pacific Conference on Transducers and Micro-Nano Technology, Perth, Australia, Jul. 6-9, 2010.
(8) C. H. Lin, C. Y. Wang, and R. Chen, “Application of Taguchi Method in the Optimization of Fabrication Parameters for Heating-Assisted Ultrasonic Nanoimprint Lithography,” International Conference on Advanced Manufacturing, Kengting, Taiwan, Feb. 2-5, 2010.
(9) C. H. Lin, C. Y. Wang, C. T. Chuang, and R. Chen, “A New Hybrid Mold Technology for Ultraviolet Nanoimprint Lithography,” 22th International Microprocesses and Nanotechnology Conference, Sapporo, Japan, Nov. 16-19, 2009.
(10) C. H. Lin, C. Y. Wang, and R. Chen, “Assisted-Heating for Ultrasonic Nanoimprint Lithography,” 9th IEEE Conference on Nanotechnology, Genoa, Italian, Jul. 26-30, 2009.
(11) C. H. Lin and R. Chen, “Impact of mold geometries and imprinted resist thickness on velocity fields for nanoimprint lithography,” 20th International Microprocesses and Nanotechnology Conference, Kyoto, Japan, Nov. 5-8, 2007.

三、國內研討會

(1) 曹韋量、方少坤、林建宏,“超音波奈米轉印平台與模仁夾持具之設計”,中國機械工程學會第三十一屆全國學術研討會,台中逢甲大學,2014。
(2) 張冠煒、何宸逸、林建宏,“應用影像回饋控制於微小物件夾取之3軸運動平台”,中國機械工程學會第三十一屆全國學術研討會,台中逢甲大學,2014。
(3) 王志豪、林福川、林建宏,“足部站姿中性狀態站立跟骨之自動化量測”,中國機械工程學會第三十屆全國學術研討會,宜蘭大學,2013。
(4) 廖崧皓、林建宏,“碳粉與碳纖維製備導電高分子特性之研”,第七屆智慧生活科技研討會,國立勤益科技大學,2012。
(5) 傅書煥、林建宏,“陣列式導電高分子力量感測器的研製”,第七屆智慧生活科技研討會,國立勤益科技大學,2012。
(6) 蘇信政、曾柏源、林建宏,“微接觸微影法應用於選區成長垂直氧化鋅奈米線陣列”,中國機械工程學會第廿八屆全國學術研討會,台中中興大學,2011。
(7) 蘇信政、辛孟翰、林建宏,“奈米轉印模仁製程技術的新構想”,中國機械工程學會第廿七屆全國學術研討會,台北台北科技大學,2010。
(8) 辛孟翰、林建宏,“應用陽極氧化鋁於奈米轉印模仁製作之研究”,2011智慧型數位生活研討會,台北中國文化大學,2011。
(9) 簡佑軒、黃佳瑋、林建宏,“步進重複式奈米轉印平台之設計與實現”,中國機械工程學會第廿七屆全國學術研討會,台北台北科技大學,2010。
(10) 林佳暐、康育齊、陳榮順、林建宏,“CMOS MEMS Z 軸微加速度計與電容感測電路之整合及實現”,第十四屆奈米工程暨微系統技術研討會,高雄國立中山大學,2010。
(11) 林建宏、王志祐、陳榮順,“加熱輔助超音波奈米轉印技術”,中國機械工程學會第廿六屆全國學術研討會暨黃光治教授逝世十週年紀念會暨論文發表會,台南成功大學,2009。
(12) 林建宏、王志祐、陳榮順,“紫外光硬化奈米轉印之新式混和透明模仁技術”,中國機械工程學會第廿六屆全國學術研討會,台南成功大學,2009。
(13) 何銘浚、曾詩閔、陳楊哲、陳榮順、林建宏,“微液珠二維共平面式設計與控制”,中國機械工程學會第廿六屆全國學術研討會,台南成功大學,2009。
(14) 林逸昕、陳榮順、林建宏,“應用紫外光成型奈米壓印製程於可撓式基板”,中國機械工程學會第廿五屆全國學術研討會,彰化大葉大學,2008。
(15) 陳勇全、陳榮順、林建宏,“以影像為基礎之先進智慧概念車輛車道保持控制系統”,中國機械工程學會第廿五屆全國學術研討會,彰化大葉大學,2008。

四、專書及專書論文